Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate
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United States of America Patent
Stats
-
Jul 16, 2002
Grant Date -
N/A
app pub date -
Nov 22, 1999
filing date -
Nov 26, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device characterized in that: a circuit substrate of a single or multiple layer which is composed in such a manner that, bumps, which are electrically connected to connection electrodes provided on one face of a surface mount device, are arranged in the same plane arrangement as that of said connection electrodes and protruded onto one side of a sheet of metal foil, on which wiring patterns electrically connected to said bumps with each other are formed, and an insulating adhesive agent layer is made to adhere onto the one side of a sheet of metal foil having bumps, is made to adhere onto one face of the surface mount device by said insulating adhesive agent layer; and tips of the bumps respectively come into contact with the connection electrodes.
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