Control system for ablating high-density array of vias or indentation in surface of object
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 16, 2002
Issued Date -
N/A
app pub date -
Mar 31, 2000
filing date -
Oct 8, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An control system for controlling movement of a product to be imaged relative to a laser and operation of a laser. The control system comprises a mechanism for obtaining drill position data from a data storage device. The control system further includes a mechanism for simultaneously sending necessary signals to alter a path of a laser beam emitted by the laser relative to the object to be imaged. The control system further includes a mechanism for providing a feedback to indicate that the path laser beam, from the laser to the product to be imaged, is suitably altered. The control system further includes a mechanism for firing the laser beam for one of burning, drilling or forming a desired formation in a surface of the object to be imaged. The control system further includes a mechanism for returning the control system, when necessary, for reading further drill position data from the data storage device.
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