Method for sample separation and lift-out with one cut
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United States of America Patent
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-
Jul 16, 2002
Issued Date -
N/A
app pub date -
May 23, 2001
filing date -
May 22, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
When a desired portion is separated from an integrated circuit chip or a semiconductor wafer, the portion is separated so that the resulting sample can be moved to a location for examination by TEM, SEM or other means. A sample portion of the chip or wafer containing an area of interest is separated with a single cut by a focused ion-beam. Prior to separation, the sample is fixed to a micromanipulator probe. The sample is moved by the probe to the location for examination and fixed there. The probe is then detached from the sample by the focused ion-beam.
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