Differential electrical transmission line structures employing crosstalk compensation and related methods

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United States of America Patent

PATENT NO 6420778
SERIAL NO

09872569

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multilayer circuit structure characterized by reduced crosstalk includes first and second superposed planar dielectric layers. On the first layer, first and second conductor lines are formed, and on the second layer, third and fourth conductor lines are formed. The first and third conductor lines, and the second and fourth conductor lines, respectively, form at least a portion of corresponding first and second differential transmission line. The first conductor line extends in parallel with the third conductor line but is both vertically spaced and horizontally offset therefrom such that a first plane orthogonal to and extending through the first and second planar layers extends through one, but not both of the first and third conductor lines (i.e., a non-overlapping region). Similarly, a second plane orthogonal to and extending through the first and second planar layers extends through a non-overlapping region of the second and fourth conductor lines.

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Patent Owner(s)

  • CUFER ASSET LTD. L.L.C.;ARALIGHT, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sinyansky, Victor Bridgewater, NJ 2 113

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