Ball grid array chip packages having improved testing and stacking characteristics
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United States of America Patent
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Jul 16, 2002
Issued Date -
N/A
app pub date -
Nov 13, 2001
filing date -
May 16, 2000
priority date (Note) -
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Abstract
A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned-in and tested in a more efficient and cost-effective manner than prior known BGA or FBGA semiconductor packages. A high-density, low-profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.
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