Modulated space transformer for high density buckling beam probe and method for making the same
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United States of America Patent
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-
Jul 16, 2002
Grant Date -
N/A
app pub date -
Jun 13, 2000
filing date -
Jun 13, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A space transformer made up of a primary structure that is fabricated from semiconductor body for retaining beam probes used for contacting the pads of a circuit or device under test. The primary structure is part of the space transformer and has vias that hold the beam probes, and a ceramic support structure to provide sufficient stiffness before bonding it to a secondary structure of the space transformer. The fabrication of the primary structure and its embedding within the secondary structure is performed in a manner analogous to the fabrication of circuit chips and its embedding within the packaging. As a result, down scaling in chip fabrication can be correspondingly applied to the fabrication of space transformers.
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