Dicing apparatus, kerf inspecting method and kerf inspecting system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 23, 2002
Grant Date -
N/A
app pub date -
Nov 3, 2000
filing date -
Nov 8, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a dicing apparatus that comprises a first blade and a second blade, the first blade cuts a wafer along a street along which the first blade has not previously cut the wafer, and the second blade cuts the wafer along a street along which the first blade has not cut the wafer, and then kerfs made by the blades are inspected. In this method, the kerfs are made along the different streets, and thus the kerfs made by the blades can be accurately inspected.
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