Deformable fluid supply line
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United States of America Patent
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Jul 23, 2002
Grant Date -
N/A
app pub date -
Aug 11, 2000
filing date -
Aug 11, 2000
priority date (Note) -
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Abstract
A deformable fluid supply line for use on a semiconductor fabrication machine is described which includes a generally S-shaped expandable joint connecting between two straight conduit sections for providing full communication thereinbetween and for providing stress absorbing characteristics such that the expandable joint can be stretched or otherwise deformed by at least 2 cm without breaking connections with the two straight conduit sections. When the generally S-shaped expandable joint is provided with a length of at least 10 cm, a deformation of at least 3.5 cm can be tolerated by the expandable joint without causing failure or otherwise damages in the connections with the two straight conduit sections. The deformable fluid supply line can survive an earthquake of the magnitude of Richter 5 scale. The invention further discloses a method for connecting a deformable fluid supply line to a fabrication machine by using an S-shaped joint connected in between two straight conduit sections. The present invention novel deformable fluid supply line can survive various forms of deformations including stretching, compressing, twisting and bending.
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