Apparatus and method for forming a bonding on a tapered part
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United States of America Patent
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-
Jul 23, 2002
Grant Date -
N/A
app pub date -
Feb 13, 2001
filing date -
Feb 13, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for forming a bonding on a tapered surface of a wall of a part to substantially eliminate the tapered surface. The method includes positioning the part and a sprayer at a predetermined distance, supplying a bonding material to the sprayer, and applying differing amounts of the bonding material from the sprayer to the tapered surface of the wall of the part to change the tapered surface of the wall of the part to a substantially non-tapered surface.
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