Semiconductor device having a power supply ring and a ground ring
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United States of America Patent
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Jul 23, 2002
Grant Date -
N/A
app pub date -
Aug 23, 2000
filing date -
Dec 7, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a semiconductor device, an influence of the simultaneous switching noise is reduced by increasing the decoupling capacity between a ground ring and a power supply ring. A semiconductor element having a plurality of electrode pads is mounted on a redistribution substrate. The power supply ring and the ground ring are formed on the redistribution substrate in a surrounding area of the semiconductor element. One of the ground ring and the power supply ring has a plurality of convex portions protruding toward the other of the ground ring and the power supply ring. The other of the ground ring and the power supply ring has a plurality of concave portions each of which receives the corresponding one of the convex portions with a predetermined distance therebetween.
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