Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball
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United States of America Patent
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-
Jul 23, 2002
Issued Date -
N/A
app pub date -
Aug 28, 2001
filing date -
Nov 30, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Within a method for forming a solder interconnection structure for use within a microelectronic fabrication, there is first provided a substrate having formed thereover a bond pad. There is then formed upon the bond pad a first solder interconnection layer. There is then formed over the first solder interconnection layer an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer. There is then formed over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.
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