Method of manufacturing a semiconductor component having a fixed electrode between two flexible diaphragms
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United States of America Patent
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-
Jul 30, 2002
Issued Date -
N/A
app pub date -
Jul 31, 2000
filing date -
Feb 2, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor component comprises a substrate (101), a two flexible pressure sensor diaphragms (106, 303) supported by the substrate (101), and a fixed electrode (203) between the two diaphragms (106, 303). The two diaphragms (106, 303) and the fixed electrode (203) are electrodes of two differential capacitors. The substrate (101) has a hole (601) extending from one surface (107) of the substrate (101) to an opposite surface (108) of the substrate (101). The hole (601) is located underneath the two diaphragms (106, 303), and the hole (601) at the opposite surfaces (107, 108) of the substrate (101) is preferably larger than the hole (601) at an interior portion of the substrate (101).
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