Semiconductor device and memory module

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United States of America Patent

PATENT NO 6426560
SERIAL NO

09608149

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Abstract

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Two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units. A memory module is so constructed that a plurality of such semiconductor storage devices, in each of which two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units, are mounted on a mounting circuit board which is square and which is formed with electrodes along one latus thereof.

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Patent Owner(s)

  • HITACHI, LTD.;HITACHI TOHBU SEMICONDUCTOR, LTD.;HITACHI ULSI SYSTEMS CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Yoshihiko Fukuoka, JP 43 646
Kawamura, Masayasu Higashiyamato, JP 16 481
Kinoshita, Yoshitaka Akishima, JP 27 472
Nakamura, Atsushi Musashino, JP 659 7366
Sakaguchi, Yoshihiro Higashimurayama, JP 32 405
Takahashi, Yasushi Saitama, JP 188 3802

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