Finishing element with finishing aids
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United States of America Patent
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-
Aug 6, 2002
Grant Date -
Jan 3, 2002
app pub date -
Jul 26, 2001
filing date -
Nov 6, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of using a finishing element and using organic lubricating films for finishing semiconductor wafers is described. The lubricants in the finishing element can be transferred to operative finishing interface forming lubricating film. The organic lubricating film thickness can be controlled to improve finishing and reduce unwanted surface defects. Differential organic lubricating film methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer and organic lubricating film methods of finishing.
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