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Abstract

A method for laminating a circuit pattern tape over a wafer, involving the steps of preparing a circuit pattern tape formed with an adhesive layer, along with a wafer, detecting at least one reference position of the prepared circuit pattern tape and at least one reference position of the prepared wafer using visual detecting means, outputting results obtained at the detecting step in the form of visual images capable of allowing a comparison of the detection results, carrying out a reference position correction involving movements of the wafer in an X-axis and/or a Y-axis direction and/or by a desired angle, thereby allowing the reference position of the circuit pattern tape and the reference position of the wafer to correspond to each other, and laminating the circuit pattern tape over the wafer when the reference positions correspond to each other.

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