Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
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United States of America Patent
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Aug 6, 2002
Grant Date -
N/A
app pub date -
Jul 8, 2000
filing date -
Jul 8, 2000
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Abstract
An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpiece to deposit a subsequent film layer onto a prior layer, wherein a condition signal from the metrology unit influences the process control of the electrochemical deposition unit. The signal can also be used to transfer the microelectronic workpiece to a layer stripping unit, or a layer enhancement unit, or to a non-compliance station. The apparatus is particularly useful in measuring seed layer thickness and adjusting the operating control of a computational fluid dynamic reactor, which electroplates a process layer onto the seed layer.
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