Multi-layer substrates and fabrication processes
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United States of America Patent
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Aug 6, 2002
Grant Date -
N/A
app pub date -
Mar 18, 1999
filing date -
Jul 7, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Multilayer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and can be selectively connected to provide customization of the structure.
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