Method for fabricating a multilayer ceramic substrate
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United States of America Patent
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-
Aug 6, 2002
Grant Date -
N/A
app pub date -
Oct 14, 1998
filing date -
Oct 14, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of fabricating a multi-layer ceramic substrate for forming a first conductive pattern on a ceramic substrate. An intaglio plate is manufactured which has first and second grooves. The grooves are filled with an electroconductive paste. Conductivity of paths in the grooves is increased by deaerating and drying the paste. The intaglio plate is glued to and then separated from a ceramic substrate so that the pattern of the pattern of the electroconductive paste is transferred to the substrate. An insulation layer and a further conductive pattern are then applied.
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