Semiconductor package having implantable conductive lands and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 6, 2002
Grant Date -
N/A
app pub date -
Oct 3, 2000
filing date -
Aug 9, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package having implantable conductive lands for simplifying the manufacture of the semiconductor package, reducing the manufacturing cost by reducing the price of raw materials and improving the electrical, thermal and mechanical performance of the semiconductor package, and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor package body and implantable conductive lands fixed in the semiconductor package body and taken off a tape film serving as a substrate of the semiconductor package until a molding process is completed. The tape film that has served as the substrate is taken off and removed from the semiconductor package body after the molding process so that the semiconductor package body does not include a substrate therewithin.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully