Ball grid array integrated circuit package with palladium coated heat-dissipation device
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United States of America Patent
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-
Aug 6, 2002
Grant Date -
N/A
app pub date -
Mar 14, 2000
filing date -
Mar 16, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A BGA (Ball-Grid Array) integrated circuit package is proposed, which is incorporated with a palladium-coated heat-dissipation device to help enhance the thermal conductivity of the integrated circuit package and make the manufacture more cost-effective to implement. The heat-dissipation device includes a base block made of heat-conductive material and a palladium layer coated over the surface of the base block. The palladium-coated base block is formed into a predefined shape having a surface exposed to the outside of an encapsulant encapsulating an integrated circuit chip of the BGA integrated circuit package. The palladium coating can help protect the exposed surface of the heat-dissipation device against oxidation and also prevent the delamination from occurrence and the marking ink from erasure. The manufacture of the BGA integrated circuit package structure is therefore more ensured in quality and more cost-effective to implement.
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