Structure for mounting a bare chip using an interposer
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United States of America Patent
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-
Aug 6, 2002
Grant Date -
Apr 18, 2002
app pub date -
Nov 10, 1997
filing date -
Feb 28, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bare chip mounting structure includes a bare chip having inlet or outlet terminals, an interposer having openings at positions corresponding to said inlet or outlet terminals of the bare chip and a circuit board having conductive pads wherein the bare chip is mounted on the circuit board by means of the interposer in such a manner that the inlet or outlet terminals are electrically connected to the conductive pads of the circuit board through the openings of the interposer.
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