Low resistance bonding in a multi-electrode double layer capacitor having single electrolyte seal and aluminum-impregnated carbon cloth electrodes
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United States of America Patent
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Aug 6, 2002
Issued Date -
N/A
app pub date -
Feb 12, 2001
filing date -
Oct 7, 1994
priority date (Note) -
In Force
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Importance
Abstract
An ultrasonically bonded electrical interconnection for use in a double layer capacitor consists of ten or more current collector foils bonded together and at least one dummy collector foil bonded to the ten or more current collector foils. The at least one dummy collector foil does not function as a current collector foil as a result of the ultrasonic bonding.
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