Importance

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Abstract

The present invention provides a fiber optic cross connect (OXC) package which utilizes a modular approach to substrate population. The OXC includes a slab, where the slab comprises a first surface and a second surface, and a micromirror array coupled to the second surface of the slab, where the micromirror array comprises a plurality of clusters, where each of the plurality of clusters includes at least one micromirror of the micromirror array. In the preferred embodiment, the slab is a substrate. Chips containing micromirrors are fabricated in clusters so that groups of micromirrors can be separately placed onto the substrate. This provides flexibility in how the substrate is populated. In the preferred embodiment, the clusters are in the form of strips. Only strips with known good micromirrors are placed onto the substrate, thus improving the device yield. Also, if any of the micromirrors become damaged after placement, its chip may be replaced without disturbing the other chips. Using a substrate through which light may travel in combination with a modular approach to substrate population allows for a single substrate switch with a higher device yield and scalability. Integrated circuits may be placed on the same substrate as the micromirrors, and the complexity of the assembly process is reduced.

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First Claim