Hybrid carrier for wide-array inkjet printhead assembly
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United States of America Patent
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Aug 13, 2002
Grant Date -
N/A
app pub date -
Mar 20, 2001
filing date -
Mar 20, 2001
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A wide-array inkjet printhead assembly includes a carrier and a plurality of printhead dies each mounted on the carrier. The carrier includes a substructure and a substrate mounted on the substructure. The substrate includes a plurality of layers and has a plurality of conductive paths extending therethrough. As such, each of the printhead dies are mounted on the substrate and electrically coupled to at least one of the conductive paths of the substrate.
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