Substrate processing system and substrate processing method
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United States of America Patent
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Aug 13, 2002
Grant Date -
N/A
app pub date -
Oct 24, 2000
filing date -
Oct 25, 1999
priority date (Note) -
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Abstract
A coating unit for coating a substrate with a treatment solution and a peripheral aligner, which has a mounting table rotatable and movable in at least one direction and irradiates the peripheral portion of the substrate on the mounting table with light from an irradiating portion to expose a coating film on the substrate, are provided in a substrate processing system. The peripheral aligner has film thickness measuring means provided with a sensor member for measuring a film thickness of the coating film. It is not necessary to separately provide a unit for measuring the film thickness outside of the system, thus preventing the substrate from being contaminated or dropped to be damaged when the film thickness is measured.
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