US Patent No: 6,432,209

Number of patents in Portfolio can not be more than 2000

Composition and method for removing resist and etching residues using hydroxylazmmonium carboxylates

ALSO PUBLISHED AS: 20020013240
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Abstract

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A mixture of hydroxylamine partially neutralized with a weak carboxylic acid and an organic solvent such as an alkyl sulfoxide, a pyrrolidinone or a sulfone removes hardened photoresist and polymeric photoresist residues from a substrate with reduced metal corrosion.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SILICON VALLEY CHEMLABS, INC.SUNNYVALE, CA7

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sahbari, Javad J San Jose, CA 21 184

Cited Art Landscape

Patent Info (Count) # Cites Year
 
EKC TECHNOLOGY, INC. (8)
5,279,771 Stripping compositions comprising hydroxylamine and alkanolamine 77 1990
5,399,464 Triamine positive photoresist stripping composition and post-ion implantation baking 26 1992
5,334,332 Cleaning compositions for removing etching residue and method of using 143 1992
5,381,807 Method of stripping resists from substrates using hydroxylamine and alkanolamine 50 1993
5,482,566 Method for removing etching residue using a hydroxylamine-containing composition 56 1994
5,672,577 Cleaning compositions for removing etching residue with hydroxylamine, alkanolamine, and chelating agent 34 1995
5,902,780 Cleaning compositions for removing etching residue and method of using 18 1997
5,911,835 Method of removing etching residue 52 1997
 
TOKYO OHKA KOGYO CO., LTD. (3)
5,795,702 Photoresist stripping liquid compositions and a method of stripping photoresists using the same 66 1996
5,792,274 Remover solution composition for resist and method for removing resist using the same 56 1996
5,968,848 Process for treating a lithographic substrate and a rinse solution for the treatment 42 1997
 
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (2)
5,648,324 Photoresist stripping composition 28 1996
5,780,406 Non-corrosive cleaning composition for removing plasma etching residues 34 1996
 
AIR PRODUCTS AND CHEMICALS, INC. (1)
5,419,779 Stripping with aqueous composition containing hydroxylamine and an alkanolamine 66 1993
 
AVANTOR PERFORMANCE MATERIALS, INC. (1)
5,308,745 Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins 101 1992
 
OLIN MICROELECTRONIC CHEMICALS, INC. (1)
5,665,688 Photoresist stripping composition 15 1996

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
KIRKER ENTERPRISES, INC. (2)
7,976,827 Nail enamel compositions having a decorative color effect 0 2006
8,765,102 Nail enamel compositions having a decorative color effect 0 2009
 
ADVANCED TECHNOLOGY MATERIALS, INC. (1)
6,773,873 pH buffered compositions useful for cleaning residue from semiconductor substrates 24 2002
 
AIR PRODUCTS AND CHEMICALS, INC. (1)
7,879,782 Aqueous cleaning composition and method for using same 1 2005
 
AVANTOR PERFORMANCE MATERIALS, INC. (1)
8,168,577 Post plasma etch/ash residue and silicon-based anti-reflective coating remover compositions containing tetrafluoroborate ion 0 2009
 
SCP SERVICES, INC. (F/K/A AKRION SCP ACQUISITION CORP.) (1)
6,878,213 Process and system for rinsing of semiconductor substrates 4 1999
 
UNITED MICROELECTRONICS CORP. (1)
7,413,848 Method of removing photoresist and photoresist rework method 1 2005

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Feb 13, 2014
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Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00

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