Substrate washing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6432212
SERIAL NO

09724366

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The substrate washing method of the present invention comprises the steps of holding the substrate substantially horizontally, supplying a cleaning liquid to a surface of the substrate through a film scrub member permeable to liquid and allowing the film scrub member in contact with the surface of the substrate, pressing the film scrub member onto the surface of the substrate in excess of a zero point, which is an initial contact point of the film scrub member with the surface of the substrate, thereby bringing the film scrub member into contact with the surface of the substrate in an overdriving manner and moving the film scrub member relative to the substrate to scrub the surface of the substrate by the film scrub member.

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First Claim

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirose, Keizo Kofu, JP 28 1006
Sekiguchi, Kenji Kofu, JP 51 655

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