Importance

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Abstract

A stereolithographically fabricated, substantially hermetic package. The package surrounds at least a portion of a semiconductor die so as to substantially hermetically seal the same. The substantially hermetic package may be fabricated from thermoplastic glass, other types of glass, ceramics, or metals. Stereolithographic processes are used to fabricate at least a portion of the substantially hermetic package. These processes may be used to form a substantially hermetic package around the semiconductor dice of assemblies including carrier substrates or leads. Stereolithographic processes may also be used to fabricate the substantially hermetic packages on bare or minimally packaged semiconductor dice, including on dice that have yet to be singulated from a wafer. As at least a portion of the substantially hermetic package is stereolithographically fabricated, that portion can have a series of superimposed, contiguous, mutually adhered layers of a suitable hermetic material. The layers can be fabricated by consolidated selected regions of a layer of unconsolidated particulate or powdered material, or by defining an object layer from a sheet of material. The stereolithographic method may include use of a machine vision system including at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which the substantially hermetic package is to be fabricated.

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First Claim