Selective copper alloy deposition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 13, 2002
Grant Date -
N/A
app pub date -
Nov 16, 2000
filing date -
Nov 16, 2000
priority date (Note) -
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Abstract
Copper or a low resistivity copper alloy is initially deposited to fill relatively narrow openings leaving relatively wider openings unfilled. A copper alloy having improved electromigration resistance with respect to copper is then selectively deposited to fill the relatively wider openings, thereby improving electromigration resistance without increasing narrow line resistance. Embodiments include annealing after filling the relatively narrow openings and before filling the relatively wider openings, thereby reducing void formation in narrow lines.
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