Face-up semiconductor chip assemblies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 13, 2002
Grant Date -
Jan 31, 2002
app pub date -
Jan 20, 2000
filing date -
Sep 24, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip is mounted in face-up disposition, with a contact-bearing front surface facing away from a substrate such as a circuit panel, and with a rear face facing toward the substrate. A backing element having terminals is disposed between the rear face of the chip and the substrate, and the terminals of the backing element are connected to contact pads on the substrate. The terminals of the backing element are movable with respect to the chip to compensate for differential thermal expansion of the chip and substrate.
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