SEMICONDUCTOR PACKAGE WITH HEAT SINK HAVING AIR VENT
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United States of America Patent
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-
Aug 13, 2002
Grant Date -
Aug 15, 2002
app pub date -
Jul 19, 2001
filing date -
Feb 13, 2001
priority date (Note) -
Granted
status (Latency Note)
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Abstract
A BGA semiconductor package having an embedded heat sink is proposed. The heat sink mounted on a substrate includes a flat portion and supporting members for supporting the flat portion to be positioned above a semiconductor chip. The flat portion is formed with at least one taper air vent for ventilating air in a gap between the flat portion and the chip during a molding process. This further helps prevent voids from forming in an encapsulant due to the air trapped in a molding resin as being flowing slowly through the gap, and avoid the occurrence of a popcorn effect on the encapsulant during a temperature cycle in subsequent processes. As a result, quality and yield for the packaged products can be significantly improved.
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