Method of making a support circuit for a semiconductor chip assembly
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United States of America Patent
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-
Aug 20, 2002
Issued Date -
N/A
app pub date -
Jun 11, 2001
filing date -
Aug 22, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a support circuit includes providing a conductive layer with top and bottom surfaces,,providing a top etch mask on the top surface that includes an opening that exposes a portion of the top surface, providing a bottom etch mask on the bottom surface that includes an opening that exposes a portion of the bottom surface, applying an etch to the exposed portion of the top surface through the opening in the top etch mask, thereby etching partially but not completely through the conductive layer and forming a recessed portion in the conductive layer below the top surface, forming an insulative base on the recessed portion without forming the insulative base on the top surface, and applying an etch to the exposed portion of the bottom surface through the opening in the bottom etch mask, thereby forming a routing line in the recessed portion that extends to and is covered by the insulative base.
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