Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact
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United States of America Patent
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Aug 20, 2002
Issued Date -
N/A
app pub date -
Jul 31, 2000
filing date -
May 23, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling
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