NOVEL HARDENER FOR EPOXY MOLDING COMPOUNDS
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United States of America Patent
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Aug 20, 2002
Grant Date -
Sep 12, 2002
app pub date -
Jan 5, 2001
filing date -
Jan 5, 2001
priority date (Note) -
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Abstract
The invention is directed to novel epoxy molding compounds for the encapsulation of microchips in the electronics industry. Known epoxy molding encapsulants are generally prepared from a blend epoxy resins, phenol hardeners, silica fillers, catalysts, flame retardant materials, processing aids and colorants. The addition of polybenzoxazines as a co-reactant with one or several epoxy resins provides a product with reduced moisture adsorption while maintaining a high glass transition temperature.
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