Importance

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Abstract

A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes in which pre-formed strips or leads inside the via holes serve as the connections between the semiconductor device and substrate circuitry. The assembling steps include attaching an integrated circuit (IC) chip having a plurality of input/output terminal pads to a rigid or flexible substrate having a plurality of leads extending from the patterned circuitry traces and hanging inside a plurality of through via holes. The via holes are aligned with and expose the terminal pads After attachment, an electrically conductive material connects the leads to the IC terminal pads through electrolytic plating, electroless (chemical) plating or solder re-flow processes. The conductive material provides mechanical support as well as electrical continuity between the IC chip and the circuitry of the substrate.

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First Claim