Thermally enhanced microcircuit package and method of forming same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 20, 2002
Grant Date -
Aug 1, 2002
app pub date -
Nov 30, 2000
filing date -
Nov 30, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.
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