IC substrate noise modeling with improved surface gridding technique
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United States of America Patent
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Aug 20, 2002
Issued Date -
N/A
app pub date -
Jan 31, 2000
filing date -
Mar 4, 1999
priority date (Note) -
Expired
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Abstract
Methods and apparatus for performing surface modeling of a substrate for the purpose of characterizing the substrate, which includes initially dividing said substrate surface into a plurality of local partitions and thereafter forming divisions from said plurality of local partitions. The technique includes positioning a first component at a first location on said substrate surface, thereby creating additional divisions within one of said plurality of local partitions. The method further includes promoting said one of said plurality of local partitions to a global partition and forming local partitions within said one of said plurality of local partitions if a number of divisions within said one of said plurality of local partitions exceeds a predefined value.
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