Concave face wire bond capillary
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United States of America Patent
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Aug 27, 2002
Issued Date -
N/A
app pub date -
Aug 27, 2001
filing date -
Sep 29, 1998
priority date (Note) -
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Abstract
An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
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