US Patent No: 6,439,970
Number of patents in Portfolio can not be more than 2000
Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
Stats
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Aug 27, 2002
Issued date -
Oct 24, 2000
filing date -
09/696,336
serial no -
In Force
status
Importance
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Abstract
A method and an apparatus for releasably attaching a polishing pad to a support surface under the polishing pad. In one embodiment of the invention, a polishing pad has a first surface for planarizing a substrate assembly, a second surface contacting the support surface, and an interlocking element. The support surface has a retaining member configured to engage the interlocking element on the polishing pad. The interlocking element and retaining member can be any one of several configurations, including: tongue and groove, protuberance and depression, reciprocal elongated ridges, or teeth.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 4,609,581 Coated abrasive sheet material with loop attachment means | 119 | 1985 | |
| 4,875,259 Intermeshable article | 98 | 1988 | |
| 5,201,785 Disc-holder assembly | 34 | 1992 | |
| 5,201,101 Method of attaching articles and a pair of articles fastened by the method | 80 | 1992 | |
| 5,958,794 Method of modifying an exposed surface of a semiconductor wafer | 253 | 1996 | |
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| 5,672,186 Method of making an abrasive article | 49 | 1996 | |
| 5,876,268 Method and article for the production of optical quality surfaces on glass | 16 | 1997 | |
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| 5,722,877 Technique for improving within-wafer non-uniformity of material removal for performing CMP | 107 | 1996 | |
| 6,261,168 Chemical mechanical planarization or polishing pad with sections having varied groove patterns | 51 | 1999 | |
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| 6,007,407 Abrasive construction for semiconductor wafer modification | 49 | 1997 | |
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| 6,099,603 System and method of attaching abrasive articles to backing pads | 9 | 1998 | |
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| 6,296,557 Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies | 99 | 1999 | |
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| 6,036,586 Apparatus and method for reducing removal forces for CMP pads | 69 | 1998 | |
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| 5,735,731 Wafer polishing device | 24 | 1996 | |
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| 4,263,755 Abrasive product | 65 | 1979 | |
| 4,617,767 Sanding, buffing and polishing tool and parts thereof | 40 | 1985 | |
| 5,097,570 Fastening system | 32 | 1991 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 27, 2014 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |