Polishing composition and polishing method employing it
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United States of America Patent
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Aug 27, 2002
Grant Date -
Apr 18, 2002
app pub date -
Aug 15, 2001
filing date -
Aug 24, 2000
priority date (Note) -
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Abstract
A polishing composition comprising: (a) an abrasives (b) a compound to form a chelate with copper ions (c) a compound to provide a protective layer-forming function to a copper layer, (d) hydrogen peroxide, and (e) water, wherein the abrasive of component (a) has a primary particle size within a range of from 50 to 120 nm.
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