Method for constructing a wafer interposer by using conductive columns
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United States of America Patent
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Aug 27, 2002
Grant Date -
N/A
app pub date -
Mar 23, 2001
filing date -
Mar 23, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention provides a method and apparatus for testing wafers that is simple and allows testing prior to dicing so that the need to temporarily package individual dies for testing is eliminated. As a result, the number of manufacturing steps is reduced, thus increasing first pass yields. In addition, manufacturing time is decreased, thereby improving cycle times and avoiding additional costs. The invention also provides for packaging of the die at the completion of testing. One form of the present invention provides an interposer substrate connected to a wafer through conductive columns.
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