Method of depositing a thermoplastic polymer in semiconductor fabrication
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United States of America Patent
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Aug 27, 2002
Grant Date -
Aug 9, 2001
app pub date -
Apr 4, 2001
filing date -
Aug 20, 1997
priority date (Note) -
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Abstract
A method of applying a dispersion (which may be in the form of a paste) of particles of a thermoplastic polymer in a liquid medium (i.e., liquid carrier) onto semiconductor wafers, dies, lead frames, and printed circuit boards, for example, to form bonding layers, pads, and bumps, etc.
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