Importance

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Abstract

A method of connecting a conductive trace to a semiconductor chip includes aligning a conductive pad on the chip with a through-hole in the conductive trace while a base covers the through-hole on a side opposite the chip wherein the conductive trace and the base are different materials, removing some or all of the base thereby exposing the through-hole, and forming a connection joint in the through-hole that electrically connects the conductive trace and the pad. The method may include electroplating the conductive trace onto the base, mechanically attaching the chip to the conductive trace using an adhesive after aligning the pad and the through-hole and before removing some or all of the base, and forming an opening in the adhesive directly beneath the through-hole thereby exposing the pad after removing some or all of the base and before forming the connection joint.

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First Claim