Multilayered substrate for semiconductor device
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United States of America Patent
Stats
-
Aug 27, 2002
Grant Date -
Aug 16, 2001
app pub date -
Mar 23, 2001
filing date -
Mar 11, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.
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