Importance

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Abstract

A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques. The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool that closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

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First Claim