Metallic microstructure springs and method of making same
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United States of America Patent
Stats
-
Aug 27, 2002
Grant Date -
N/A
app pub date -
Dec 3, 1999
filing date -
Dec 3, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A spring suitable for use in interposers such as those used to electrically interconnect electronic devices such as integrated circuits and printed wiring boards. The spring includes a central portion, a peripheral portion and a plurality of bent legs extending between the central portion and the peripheral portion. The bent legs optionally comprise alternating layers of copper and nickel. At least ode protuberance is preferably formed upon either side of the generally planar spring so as to facilitate electrical contact with desired electrical contacts of the devices to be interconnected.
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