Slurry for CMP and CMP method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 3, 2002
Grant Date -
N/A
app pub date -
Mar 17, 2000
filing date -
Mar 17, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A CMP slurry comprising polishing abrasives containing mixture abrasives of silica and alumina is used. In CMP using the slurry comprising mixture abrasives of silica and alumina as polishing abrasives, a down force-dependency of a polishing rate is high and an increase in dishing can be effectively suppressed.
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