Method and apparatus for controlling a plating process
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United States of America Patent
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Sep 3, 2002
Grant Date -
N/A
app pub date -
Jul 2, 2001
filing date -
Jul 2, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A method for controlling a plating process includes plating a process layer on a wafer in accordance with a recipe; measuring a thickness of the process layer; and determining at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness. A processing line includes a plating tool, a metrology tool, and a process controller. The plating tool is adapted to form a process layer on a wafer in accordance with a recipe. The metrology tool is adapted to measure a thickness of the process layer. The process controller is adapted to determine at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness.
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