Two stage transfer molding method to encapsulate MMC module
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United States of America Patent
Stats
-
Sep 3, 2002
Grant Date -
N/A
app pub date -
Jun 12, 2001
filing date -
Jun 12, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery. A method for fabricating the semiconductor card is also included.
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