Semiconductor sensor device and method of manufacturing the same
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United States of America Patent
Stats
-
Sep 3, 2002
Grant Date -
Dec 27, 2001
app pub date -
May 30, 2001
filing date -
Jun 27, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
Plural semiconductor chips such as acceleration sensor chips formed on the first surface of a substrate are separated into individual pieces by dicing the substrate from the second surface thereof. A groove surrounding each sensor chip, along which the sensor chip is diced out, is formed at the same time the sensor chip is formed on the first surface. Before dicing, a protecting sheet covering the first surface is pasted along the sidewalls and the bottom wall of the groove. The groove is made sufficiently wide to ensure that the protecting sheet is bent along the walls of the groove without leaving a space between the groove and the protecting sheet. Thus, dicing dusts generated in the dicing process are prevented from being scattered and entering the sensor chip.
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